AAVID THERMALLOY 374324B00035G Heat Sink, Square, PCB, For Ball Grid Arrays, BGA, 30.6 °C/W, 10 mm, 27 mm, 27 mm LensCoat LW107BK UPC: 037733005316

UPC: 037733005316

Suitable for Digital Prints

and DO pins of the microSD socket are broken out to the ATmega168/328’s standard SPI pins (digital 11-13)

DB9 Serial Plug

and the included windscreen minimizes wind noise

AAVID THERMALLOY 374324B00035G Heat Sink, Square, PCB, For Ball Grid Arrays, BGA, 30.6 °C/W, 10 mm, 27 mm, 27 mm LensCoat LW107BK UPC: 037733005316Tape mounting saves board space by eliminating mounting holes Convenient peel and stick assembly is quick and clean Pin Fin array allows omni directional airflow to maximize heat dissipation Fin dimensions (LxW): 13x12mm Product details External Diameter Metric Packages Cooled BGA Heat Sink Material Aluminium Thermal Resistance 30. 6C W External Length Imperial 1. 06" External Length Metric 27mm External Width Metric 27mm External Diameter Imperial