WAKEFIELD SOLUTIONS 637-15ABEP Heat Sink, For Board Level Power Semiconductor, TO-220, 11 �C/W, 38.1 mm, 34.9 mm, 12.7 mm Ricoh 308937 if working with stamps or

if working with stamps or coins

Rigid Leather-Like Cover

RMCARD305 Environmental Operating Temperature 32 to 104°F (0 to 40°C) Operating Humidity 0 to 90% (non-condensing) Operating Elevation 0 to 10

8" Product Range - Plate Colour - External Depth - Metric 238mm Other details

5 cm) rubber ball "B" size Base Diameter 2

WAKEFIELD SOLUTIONS 637-15ABEP Heat Sink, For Board Level Power Semiconductor, TO-220, 11 �C/W, 38.1 mm, 34.9 mm, 12.7 mm Ricoh 308937 if working with stamps orThe 637 15ABEP is a 38. 1 x 34. 9 x 12. 7mm high efficiency Heat Sink made of aluminium with black anodized finish. This board level heat sink features wave solderable pins on 1 inch centre for vertical mounting on printed circuit boards. Use this heat sink where weight and board space occupied must be minimized. Applications Industrial Product details External Diameter Metric Packages Cooled TO 220 Heat Sink Material Aluminium Thermal Resistance 11C