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Bluetooth Built-in BLE (Bluetooth Low Energy) module supports Bluetooth 5
0 PCI Express Configurations ‡ Up to 1x16+2x4 | 2x8+2x4 | 1x8+4x4 Max # of PCI Express Lanes 24 Package Specifications Sockets Supported FCLGA1851 Thermal Solution Specification PCG 2020A Max Operating Temperature 105 °C Package Size 45 mm x 37
- 1 x PCI Express x1 slot
411 (V) mm Pixel Pitch 0
* RAID 5 is only available on AMD Ryzen™ 9000 Series Processors
GIGABYTE Ultra Durable H810 MATX GA-H810M H GEN5 Motherboard M Bluetooth Built-in BLE (Bluetooth LowH810M H GEN5 H810 , PCIe Gen5 PCIe 5. 0 PCIe 4. 0 16 GT s 32 GT s AI Intel H810 DDR5 6400 5600 MT s 2DDR5 DIMM128 GB (64 GB) Sound Realtek High Definition Audio 2 4 5. 1 7. 1 * 7. 1 Connectivity Realtek GbE (1 Gbps 100 Mbps 10 Mbps) Expansion Slot CPU 1PCI Express x16PCIe 5. 0x16(PCIEX16) * PCIEX16NVMe SSD 1PCI Express x1PCIe 3. 0x1(PCIEX1) Storage Interface 1M. 2(Socket 3M keytype 2280 PCIe 4. 0 x4 x2 SSD) 4SATA 6Gb s USB 1USB Type CUSB 3. 2 Gen 1USB
